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fn6807 rev 5.00 page 1 of 36 may 31, 2016 fn6807 rev 5.00 may 31, 2016 kad5512p low power 12-bit, 250/210/170/125msps adc datasheet the kad5512p is the low-power member of the kad5512 family of 12-bit analog-to-digital converters. designed with intersil?s proprietary femtocharge? technology on a standard cmos process, the family supports sampling rates of up to 250msps. the kad5512p is part of a pin-compatible portfolio of 10, 12 and 14-bit a/ds with sample rates ranging from 125msps to 500msps. a serial peripheral interface (spi) port allows for extensive configurability, as well as fine control of various parameters such as gain and offset. digital output data is presented in selectable lvds or cmos formats. the kad5512p is available in 72 ld and 48 ld qfn packages with an exposed paddle. operating from a 1.8v supply, performance is specified over the full industrial temperature range (-40c to +85c). key specifications ?snr = 66.1dbfs for f in = 105mhz (-1dbfs) ?sfdr = 87dbc for f in = 105mhz (-1dbfs) ?total power consumption - 267/219mw at 250/125msps (sdr mode) - 234/189mw at 250/125msps (ddr mode) related literature ? kad5512p-50 datasheet ? kad5512hp , datasheet features ? half the power of the pin-compatible kad5512hp family ? 1.5ghz analog input bandwidth ? 60fs clock jitter ? programmable gain, offset and skew control ? over-range indicator ? selectable clock divider: 1, 2 or 4 ? clock phase selection ? nap and sleep modes ? two?s complement, gray code or binary data format ? sdr/ddr lvds-compatible or lvcmos outputs ? programmable built-in test patterns ? single-supply 1.8v operation ? pb-free (rohs compliant) applications ? power amplifier linearization ? radar and satellite antenna array processing ? broadband communications ? high-performance data acquisition ? communications test equipment ? wimax and microwave receivers figure 1. block diagram figure 2. single-tone spectr um at 105mhz (250msps) digital error correction lvds/cmos drivers 1.25v clock generation sha vinp vinn 12-bit 250 msps adc clkp clkn spi control csb sclk sdio ovss avss avdd clkoutp clkoutn d[11:0]p d[11:0]n orp orn outfmt outmode ovdd sdo napslp clkdiv + ? vcm 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 frequency (mhz) amplitude (dbfs) ain = -1.0dbfs snr = 66.0dbfs sfdr = 86.5dbc sinad = 65.9dbfs
kad5512p fn6807 rev 5.00 page 2 of 36 may 31, 2016 table of contents ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 pin configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 pin descriptions - 72 ld qfn . . . . . . . . . . . . . . . . . . . . . . . . . . 4 pin configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 pin descriptions - 48 ld qfn . . . . . . . . . . . . . . . . . . . . . . . . . . 7 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 recommended operating conditions . . . . . . . . . . . . . . . . . . 9 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 digital specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 switching specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 typical performance curves . . . . . . . . . . . . . . . . . . . . . . . . .15 theory of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 power-on calibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 user-initiated reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 analog input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 vcm output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 voltage reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 digital outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 over range indicator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 nap/sleep. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 data format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . 24 spi physical interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 spi configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 indexed device configuration/control. . . . . . . . . . . . . . . . . . 25 global device configuration/control . . . . . . . . . . . . . . . . . . . 26 device test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 72 ld/48 ld package options . . . . . . . . . . . . . . . . . . . . . . . . 27 spi memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 equivalent circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 adc evaluation platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 layout considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 pcb layout example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 split ground and power planes . . . . . . . . . . . . . . . . . . . . . . . 31 clock input considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 exposed paddle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 bypass and filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 lvds outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 lvcmos outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 unused inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 general powerpad design considerations . . . . . . . . . . . . 31 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 about intersil. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 package outline drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 l48.7x7e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 l72.10x10d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
kad5512p fn6807 rev 5.00 page 3 of 36 may 31, 2016 table 1. pin-compatible family model resolution speed (msps) package q48ep q72ep kad5514p-25/21/17/12 14 250/210/170/125 x x kad5512p-50 12 500 x kad5512p-25/21/17/12 12 250/210/170/125 x x kad5512hp-25/21/17/12 12 250/210/170/125 x x kad5510p-50 10 500 x kad5510p-25/21/17/12 10 250/210/170/125 x ordering information part number ( note 3 ) part marking speed (msps) temp. range (c) package (rohs compliant) pkg. dwg. # kad5512p-25q72 ( note 1 ) kad5512p-25 q72ep-i 250 -40 to +85 72 ld qfn l72.10x10d kad5512p-21q72 ( note 1 ) kad5512p-21 q72ep-i 210 -40 to +85 72 ld qfn l72.10x10d kad5512p-17q72 ( note 1 ) kad5512p-17 q72ep-i 170 -40 to +85 72 ld qfn l72.10x10d kad5512p-12q72 ( note 1 ) kad5512p-12 q72ep-i 125 -40 to +85 72 ld qfn l72.10x10d KAD5512P-25Q48 ( note 2 ) kad5512p-25 q48ep-i 250 -40 to +85 48 ld qfn l48.7x7e kad5512p-21q48 ( note 2 ) kad5512p-21 q48ep-i 210 -40 to +85 48 ld qfn l48.7x7e kad5512p-17q48 ( note 2 ) kad5512p-17 q48ep-i 170 -40 to +85 48 ld qfn l48.7x7e kad5512p-12q48 ( note 2 ) kad5512p-12 q48ep-i 125 -40 to +85 48 ld qfn l48.7x7e notes: 1. these intersil pb-free plastic packaged products employ specia l pb-free material sets; molding compounds/die attach materials and nipdau plate-e4 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free pr oducts are msl classified at pb-free peak reflow temp eratures that meet or exceed the pb-fr ee requirements of ipc/jedec j std-020. 2. these intersil pb-free plastic packaged products employ spec ial pb-free material sets, molding compounds/die attach materials , and 100% matte tin plate plus anneal (e3 termination finish , which is rohs compliant and compatible wi th both snpb and pb-free soldering opera tions). intersil pb-free products are msl classified at pb-fr ee peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jed ec j std-020. 3. for moisture sensitivity level (msl), please see device information page for kad5512p -25 , kad5512p-21 , kad5512p-17 , kad5512p-12 . for more information on msl please see techbrief tb363 .
kad5512p fn6807 rev 5.00 page 4 of 36 may 31, 2016 pin configuration kad5512p (72 ld qfn) top view avss avdd outfmt sdio 72 71 70 69 68 67 66 65 64 63 62 61 sclk csb sdo ovss orp orn d11p d11n 60 59 d10p d10n d8p d8n d7p d7n d6p d6n clkoutp clkoutn rlvds ovss d5p d5n d4p d4n 1 2 3 4 5 6 7 8 9 10 11 12 13 14 54 53 52 51 50 49 48 47 46 45 44 43 42 41 avdd dnc dnc dnc dnc avdd avss avss vinn vinp avss avdd dnc dnc 19 20 21 22 23 24 25 26 27 28 29 30 31 32 avdd clkp clkn outmode napslp avdd resetn ovss ovdd dnc dnc dnc dnc d0n 15 16 17 18 vcm clkdiv dnc dnc 33 34 35 36 d0p d1n d1p ovdd d3p d3n d2p d2n 40 39 38 37 58 57 d9p d9n 56 55 ovdd ovss connect thermal pad to avss pad pin descriptions - 72 ld qfn pin number lvds [lvcmos] name lvds [lvcmos] function sdr mode ddr mode comments 1, 6, 12, 19, 24, 71 avdd 1.8v analog supply 2, 3, 4, 5, 13, 14, 17, 18, 28, 29, 30, 31 dnc do not connect 7, 8, 11, 72 avss analog ground 9, 10 vinn, vinp analog input negative, positive 15 vcm common-mode output 16 clkdiv tri-level clock divider control
kad5512p fn6807 rev 5.00 page 5 of 36 may 31, 2016 20, 21 clkp, clkn clock input true, complement 22 outmode tri-level output mode control (lvds, lvcmos) 23 napslp tri-level power control (nap, sleep modes) 25 resetn power-on reset (active low, see page 19 ) 26, 45, 55, 65 ovss output ground 27, 36, 56 ovdd 1.8v output supply 32 d0n [nc] lvds bit 0 (lsb) output complement [nc in lvcmos] ddr logical bits 1, 0 (lvds) 33 d0p [d0] lvds bit 0 (lsb) output true [lvcmos bit 0] ddr logical bits 1, 0 (lvds or cmos) 34 d1n [nc] lvds bit 1 output complement [nc in lvcmos] nc in ddr 35 d1p [d1] lvds bit 1 output true [lvcmos bit 1] nc in ddr 37 d2n [nc] lvds bit 2 output complement [nc in lvcmos] ddr logical bits 3, 2 (lvds) 38 d2p [d2] lvds bit 2 output true [lvcmos bit 2] ddr logical bits 3, 2 (lvds or cmos) 39 d3n [nc] lvds bit 3 output complement [nc in lvcmos] nc in ddr 40 d3p [d3] lvds bit 3 output true [lvcmos bit 3] nc in ddr 41 d4n [nc] lvds bit 4 output complement [nc in lvcmos] ddr logical bits 5, 4 (lvds) 42 d4p [d4] lvds bit 4 output true [lvcmos bit 4] ddr logical bits 5, 4 (lvds or cmos) 43 d5n [nc] lvds bit 5 output complement [nc in lvcmos] nc in ddr 44 d5p [d5] lvds bit 5 output true [lvcmos bit 5] nc in ddr 46 rlvds lvds bias resistor (connect to ovss with a 10k , 1% resistor) 47 clkoutn [nc] lvds clock output complement [nc in lvcmos] 48 clkoutp [clkout] lvds clock output true [lvcmos clkout] 49 d6n [nc] lvds bit 6 output complement [nc in lvcmos] ddr logical bits 7, 6 (lvds) 50 d6p [d6] lvds bit 6 output true [lvcmos bit 6] ddr logical bits 7, 6 (lvds or cmos) 51 d7n [nc] lvds bit 7 output complement [nc in lvcmos] nc in ddr 52 d7p [d7] lvds bit 7 output true [lvcmos bit 7] nc in ddr 53 d8n [nc] lvds bit 8 output complement [nc in lvcmos] ddr logical bits 9, 8 (lvds) pin descriptions - 72 ld qfn (continued) pin number lvds [lvcmos] name lvds [lvcmos] function sdr mode ddr mode comments
kad5512p fn6807 rev 5.00 page 6 of 36 may 31, 2016 54 d8p [d8] lvds bit 8 output true [lvcmos bit 8] ddr logical bits 9, 8 (lvds or cmos) 57 d9n [nc] lvds bit 9 output complement [nc in lvcmos] nc in ddr 58 d9p [d9] lvds bit 9 output true [lvcmos bit 9] nc in ddr 59 d10n [nc] lvds bit 10 output complement [nc in lvcmos] ddr logical bits 11, 10 (lvds) 60 d10p [d10] lvds bit 10 output true [lvcmos bit 10] ddr logical bits 11, 10 (lvds or cmos) 61 d11n [nc] lvds bit 11 output complement [nc in lvcmos] nc in ddr 62 d11p [d11] lvds bit 11 output true [lvcmos bit 11] nc in ddr 63 orn [nc] lvds over-range complement [nc in lvcmos] 64 orp [or] lvds over-range true [lvcmos over-range] 66 sdo spi serial data output (4.7k pull-up to ovdd is required) 67 csb spi chip select (active low) 68 sclk spi clock 69 sdio spi serial data input/output 70 outfmt tri-level output data format control (two?s complement, gray code, offset binary) pad (exposed paddle) avss analog ground (connect to a low thermal impedance analog ground plane with multiple vias) note: lvcmos output mode functionality is sh own in brackets (nc = no connection). sdr is the default state at power-up for the 7 2 ld package. pin descriptions - 72 ld qfn (continued) pin number lvds [lvcmos] name lvds [lvcmos] function sdr mode ddr mode comments
kad5512p fn6807 rev 5.00 page 7 of 36 may 31, 2016 pin configuration kad5512p (48 ld qfn) top view figure 3. pin configuration avss avdd sdio sclk 1 2 3 4 5 6 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 csb sdo ovss orp orn d5p d5n ovdd avdd clkp clkn napslp avdd resetn ovss ovdd dnc dnc d0n d0p d4p d4n d3p d3n clkoutp clkoutn rlvds ovss d2p d2n d1p d1n avdd dnc dnc dnc avss vinn vinp avss avdd vcm dnc avss connect thermal pad to avss pad pin descriptions - 48 ld qfn pin number lvds [lvcmos] name lvds [lvcmos] function 1, 9, 13, 17, 47 avdd 1.8v analog supply 2, 3, 4, 11, 21, 22 dnc do not connect 5, 8, 12, 48 avss analog ground 6, 7 vinn, vinp analog input negative, positive 10 vcm common-mode output 14, 15 clkp, clkn clock input true, complement 16 napslp tri-level power co ntrol (nap, sleep modes) 18 resetn power on reset (active low, see page 19 ) 19, 29, 42 ovss output ground 20, 37 ovdd 1.8v output supply 23 d0n [nc] lvds ddr logical bits 1, 0 output complement [nc in lvcmos]
kad5512p fn6807 rev 5.00 page 8 of 36 may 31, 2016 24 d0p [d0] lvds ddr logical bits 1, 0 output true [cmos ddr logical bits 1, 0 in lvcmos] 25 d1n [nc] lvds ddr logical bits 3, 2 output complement [nc in lvcmos] 26 d1p [d1] lvds ddr logical bits 3, 2 output true [cmos ddr logical bits 3, 2 in lvcmos] 27 d2n [nc] lvds ddr logical bits 5, 4 output complement [nc in lvcmos] 28 d2p [d2] lvds ddr logical bits 5, 4 output true [cmos ddr logical bits 5, 4 in lvcmos] 30 rlvds lvds bias resistor (connect to ovss with a 10k , 1% resistor) 31 clkoutn [nc] lvds clock output complement [nc in lvcmos] 32 clkoutp [clkout] lvds clock output true [lvcmos clkout] 33 d3n [nc] lvds ddr logical bits 7, 6 output complement [nc in lvcmos] 34 d3p [d3] lvds ddr logical bits 7, 6 output true [cmos ddr logical bits 7, 6 in lvcmos] 35 d4n [nc] lvds ddr logical bits 9, 8 output complement [nc in lvcmos] 36 d4p [d4] lvds ddr logical bits 9, 8 output true [cmos ddr logical bits 9, 8 in lvcmos] 38 d5n [nc] lvds ddr logical bits 11, 10 output complement [nc in lvcmos] 39 d5p [d5] lvds ddr logical bits 11, 10 output true [cmos ddr logical bits 11, 10 in lvcmos] 40 orn [nc] lvds over-range complement [nc in lvcmos] 41 orp [or] lvds over-range true [lvcmos over-range] 43 sdo spi serial data output (4.7k pull-up to ovdd is required) 44 csb spi chip select (active low) 45 sclk spi clock 46 sdio spi serial data input/output pad (exposed paddle) avss analog ground (connect to a low ther mal impedance analog ground plane with multiple vias) note: lvcmos output mode functionality is shown in brackets (nc = no connection). pin descriptions - 48 ld qfn (continued) pin number lvds [lvcmos] name lvds [lvcmos] function
kad5512p fn6807 rev 5.00 page 9 of 36 may 31, 2016 absolute maximum rating s thermal information avdd to avss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.4v to 2.1v ovdd to ovss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.4v to 2.1v avss to ovss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 0.3v analog inputs to avss . . . . . . . . . . . . . . . . . . . . . . . . . -0.4v to avdd + 0.3v clock inputs to avss . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4v to avdd + 0.3v logic input to avss . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4v to ovdd + 0.3v logic inputs to ovss . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4v to ovdd + 0.3v thermal resistance (typical) ? ja (c/w) ? jc (c/w) 48 ld qfn (notes 4, 5) . . . . . . . . . . . . . . . . 25 0.5 72 ld qfn (note 4, 5) . . . . . . . . . . . . . . . . . 24 0.5 storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65c to +150c junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see tb493 recommended operating conditions avdd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.8v ovdd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.8v temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40c to +85c caution: do not operate at or near the maximum ratings listed for extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 4. ? ja is measured in free air with the componen t mounted on a high effective thermal conduc tivity test board with ?direct attach? fe atures. see tech brief tb379 . 5. for ? jc , the ?case temp? location is the center of the exposed metal pad on the package underside. electrical specifications all specifications apply under the following conditions unless otherwise noted: avdd = 1.8v, ovdd = 1.8v, t a = -40c to +85c (typical specifications at +25c), a in = -1dbfs, f sample = maximum conversion rate (per speed grade). boldface limits apply across the operating temperature range, -40c to +85c. parameter symbol test conditions kad5512p-25 ( note 6 ) kad5512p-21 ( note 6 ) kad5512p-17 ( note 6 ) kad5512p-12 ( note 6 ) unit min typ max min typ max min typ max min typ max dc specifications analog input full-scale analog input range v fs differential 1.40 1.47 1.54 1.40 1.47 1.54 1.40 1.47 1.54 1.40 1.47 1.54 v p-p input resistance r in differential 1000 1000 1000 1000 input capacitance c in differential 1.8 1.8 1.8 1.8 pf full-scale range temperature drift a vtc full temperature90909090ppm/c input offset voltage v os -10 2 10 -10 2 10 -10 2 10 -10 2 10 mv gain error e g 0.6 0.6 0.6 0.6 % common-mode output voltage v cm 435 535 635 435 535 635 435 535 635 435 535 635 mv common-mode input current (per pin) i cm 2.5 2.5 2.5 2.5 ? a/ msps clock inputs inputs common-mode voltage 0.9 0.9 0.9 0.9 v clkp, clkn input swing 1.8 1.8 1.8 1.8 v power requirements 1.8v analog supply voltage avdd 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 v 1.8v digital supply voltage ovdd 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 v
kad5512p fn6807 rev 5.00 page 10 of 36 may 31, 2016 1.8v analog supply current i avdd 90 101 83 94 77 87 69 79 ma 1.8v digital supply current (sdr) ( note 7 ) i ovdd 3ma lvds 58 62 56 60 54 58 52 56 ma 1.8v digital supply current (ddr) ( note 7 ) i ovdd 3ma lvds 39 38 36 35 ma power supply rejection ratio psrr 30mhz, 200mv p-p signal on avdd -36 -36 -36 -36 db total power dissipation normal mode (sdr) p d 3ma lvds 267 286 252 271 237 253 219 235 mw normal mode (ddr) p d 3ma lvds 234 219 204 189 mw nap mode p d 84 98.6 80 94.6 78 91.6 74 87.6 mw sleep mode p d csb at logic high 2 6 2 6 2 6 2 6 mw nap mode wake-up time ( note 8 ) sample clock running 1111s sleep mode wake-up time ( note 8 ) sample clock running 1111ms ac specifications differential nonlinearity dnl -0.8 0.3 0.8 -0.8 0.3 0.8 -0.8 0.3 0.8 -0.8 0.3 0.8 lsb integral nonlinearity inl -2.0 0.8 2.0 -2.0 1.1 2.0 -2.0 1.1 2.0 -2.5 1.4 2.5 lsb minimum conversion rate ( note 9 ) f s min 40 40 40 40 msps maximum conversion rate f s max 250 210 170 125 msps signal-to-noise ratio snr f in = 10mhz 66.1 66.6 66.9 67.1 dbfs f in = 105mhz 64.0 66.1 64.5 66.6 65.0 66.9 65.2 67.1 dbfs f in = 190mhz 65.9 66.3 66.7 66.8 dbfs f in = 364mhz 65.4 65.7 66.1 66.1 dbfs f in = 695mhz 63.8 64.2 64.4 64.1 dbfs f in = 995mhz 62.6 62.4 62.7 62.4 dbfs signal-to-noise and distortion sinad f in = 10mhz 65.3 65.6 65.8 66.3 dbfs f in = 105mhz 63.3 65.3 63.8 65.6 64.3 65.8 64.3 66.3 dbfs f in = 190mhz 64.6 65.2 65.5 65.6 dbfs f in = 364mhz 63.9 64.3 64.7 64.1 dbfs f in = 695mhz 56.9 57.2 57.9 57.4 dbfs f in = 995mhz 49.6 44.9 48.3 49.3 dbfs electrical specifications all specifications apply under the following conditions unless otherwise noted: avdd = 1.8v, ovdd = 1.8v, t a = -40c to +85c (typical specifications at +25c), a in = -1dbfs, f sample = maximum conversion rate (per speed grade). boldface limits apply across the operating temperature range, -40c to +85c. (continued) parameter symbol test conditions kad5512p-25 ( note 6 ) kad5512p-21 ( note 6 ) kad5512p-17 ( note 6 ) kad5512p-12 ( note 6 ) unit min typ max min typ max min typ max min typ max
kad5512p fn6807 rev 5.00 page 11 of 36 may 31, 2016 effective number of bits enob f in = 10mhz 10.6 10.6 10.6 10.7 bits f in = 105mhz 10.3 10.6 10.4 10.6 10.5 10.6 10.5 10.7 bits f in = 190mhz 10.4 10.5 10.6 10.6 bits f in = 364mhz 10.3 10.4 10.5 10.4 bits f in = 695mhz 9.2 9.2 9.3 9.2 bits f in = 995mhz 7.9 7.2 7.7 7.9 bits spurious-free dynamic range sfdr f in = 10mhz 83.0 81.4 78.8 79.6 dbc f in = 105mhz 70 87 70 86.2 70 84.4 70 86 dbc f in = 190mhz 79.4 80.5 81.8 82.0 dbc f in = 364mhz 76.1 76.1 78.2 71.8 dbc f in = 695mhz 60.6 61.4 61.6 61.6 dbc f in = 995mhz 50.7 46.4 49.2 50.3 dbc intermodulation distortion imd f in = 70mhz -85.7 -92.1 -94.5 -95.1 dbfs f in = 170mhz -97.1 -87.1 -91.6 -85.7 dbfs word error rate wer 10 -12 10 -12 10 -12 10 -12 full power bandwidth fpbw 1.5 1.5 1.5 1.5 ghz notes: 6. parameters with min and/or max limits are 100% producti on tested at their worst case temperature extreme (+85c). 7. digital supply current is dependent upon the capacitive loading of the digital outputs. i ovdd specifications apply for 10pf load on each digital output. 8. see ? nap/sleep ? on page 21 for more details. 9. the dll range setting must be changed for low speed operation. see ? serial peripheral interface ? on page 24 for more detail. electrical specifications all specifications apply under the following conditions unless otherwise noted: avdd = 1.8v, ovdd = 1.8v, t a = -40c to +85c (typical specifications at +25c), a in = -1dbfs, f sample = maximum conversion rate (per speed grade). boldface limits apply across the operating temperature range, -40c to +85c. (continued) parameter symbol test conditions kad5512p-25 ( note 6 ) kad5512p-21 ( note 6 ) kad5512p-17 ( note 6 ) kad5512p-12 ( note 6 ) unit min typ max min typ max min typ max min typ max
kad5512p fn6807 rev 5.00 page 12 of 36 may 31, 2016 digital specifications parameter symbol test conditions min typ max unit inputs input current high (sdio, resetn, csb, sclk) i ih v in = 1.8v 0 1 10 a input current low (sdio, resetn, csb, sclk) i il v in = 0v -25 -12 -5 a input voltage high (sdi o, resetn, csb, sclk) v ih 1.17 v input voltage low (sdio, resetn, csb, sclk) v il .63 v input current high (outmode, napslp, clkdiv, outfmt) ( note 10 ) i ih 15 25 40 a input current low (outmode, napslp, clkdiv, outfmt) i il -40 25 -15 a input capacitance c di 3pf lvds outputs differential output voltage v t 3ma mode 620 mv p-p output offset voltage v os 3ma mode 950 965 980 mv output rise time t r 500 ps output fall time t f 500 ps cmos outputs voltage output high v oh i oh = -500a ovdd - 0.3 ovdd - 0.1 v voltage output low v ol i ol = 1ma 0.1 0.3 v output rise time t r 1.8 ns output fall time t f 1.4 ns
kad5512p fn6807 rev 5.00 page 13 of 36 may 31, 2016 timing diagrams figure 4a. ddr figure 4b. sdr figure 4. lvds timing diagrams (see ? digital outputs ? on page 21 ) figure 5a. ddr figure 5b. sdr figure 5. cmos timing diagram (see ? digital outputs ? on page 21 ) latency = l cycles tdc tpd ta sample n tcpd inp inn clkn clkp clkoutn clkoutp odd bits n-l n-l odd bits odd bits even bits n-l + 1 n-l + 1 n-l + 2 n-l + 2 even bits even bits even bits d[10/8/6/4/2/0]p d[10/8/6/4/2/0]n n latency = l cycles tdc tpd ta sample n tcpd inp inn clkn clkp clkoutn clkoutp data data n-l + 1 d[11/0]p d[11/0]n n data n-l sample n tdc tpd ta inp inn clkn clkout clkp d[10/8/6/4/2/0] latency = l cycles odd bits n-l n-l odd bits odd bits even bits n-l + 1 n-l + 1 n-l + 2 n-l + 2 even bits even bits even bits n tcpd sample n inp inn clkn clkout clkp tcpd ta d[11/0] tdc tpd data n-l data data n-l + 1 n latency = l cycles
kad5512p fn6807 rev 5.00 page 14 of 36 may 31, 2016 switching specifications parameter test conditions symbol min typ max unit adc output aperture delay t a 375 ps rms aperture jitter j a 60 fs output clock to data propagation delay, lvds mode ( note 11 ) ddr rising edge t dc -260 -50 120 ps ddr falling edge t dc -160 10 230 ps sdr falling edge t dc -260 -40 230 ps output clock to data propagation delay, cmos mode ( note 11 ) ddr rising edge t dc -220 -10 200 ps ddr falling edge t dc -310 -90 110 ps sdr falling edge t dc -310 -50 200 ps latency (pipeline delay) l 7.5 cycles overvoltage recovery t ovr 1cycles spi interface ( notes 12 , 13 ) sclk period write operation t clk 16 cycles ( note 12 ) read operation t clk 66 cycles sclk duty cycle (t hi /t clk or t lo /t clk) read or write 255075 % csb ?? to sclk ? set-up time read or write t s 1cycles csb ?? after sclk ? hold time read or write t h 3cycles data valid to sclk ? set-up time write t dsw 1cycles data valid after sclk ? hold time write t dhw 3cycles data valid after sclk ? time read t dvr 16.5 cycles data invalid after sclk ? time read t dhr 3cycles sleep mode csb ?? to sclk ? set-up time ( note 14 ) read or write in sleep mode t s 150 s notes: 10. the tri-level inputs internal switching thresholds are approx imately 0.43v and 1.34v. it is advised to float the inputs, tie to ground or avdd depending on desired function. 11. the input clock to output clock delay is a function of sample rate, using the output clock to latch the data simplifies data capture for most applications. contact factory for more info if needed. 12. spi interface timing is directly proportional to the adc sample period (4ns at 250msps). 13. the spi may operate asynchronously with respect to the adc sample clock. 14. the csb set-up time increases in sleep mode due to the reduced power state, csb set-up time in nap mode is equal to normal m ode csb set-up time (4ns min).
kad5512p fn6807 rev 5.00 page 15 of 36 may 31, 2016 typical performance curves all typical performance characteristics appl y under the following conditions unless otherwise noted: avdd = ovdd = 1.8v, t a = +25c, a in = -1dbfs, f in = 105mhz, f sample = maximum conversion rate (per speed grade). figure 6. snr and sfdr vs f in figure 7. hd2 and hd3 vs f in figure 8. snr and sfdr vs a in figure 9. hd2 and hd3 vs a in figure 10. snr and sfdr vs f sample figure 11. hd2 and hd3 vs f sample 50 55 60 65 70 75 80 85 90 0 200m 400m 600m 800m 1g input frequency (hz) snr (dbfs) and sfdr (dbc) snr at 250msps sfdr at 250msps sfdr at 125msps snr at 125msps -100 -95 -90 -85 -80 -75 -70 -65 -60 -55 -50 0 200m400m600m800m 1g input frequency (hz) hd2 and hd3 magnitude (dbc) hd2 at 250msps hd3 at 125msps hd3 at 250msps hd2 at 125msps 0 10 20 30 40 50 60 70 80 90 100 -60 -50 -40 -30 -20 -10 0 input amplitude (dbfs) snr and sfdr snr (dbc) sfdr (dbc) snrfs (dbfs) sfdrfs (dbfs) -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -60-50-40-30-20-10 0 input amplitude (dbfs) hd2 & hd3 magnitude hd2 (dbc) hd3 (dbc) hd3 (dbfs) hd2 (dbfs) 60 65 70 75 80 85 90 95 40 70 100 130 160 190 220 250 sample rate (msps) snr (dbfs) and sfdr (dbc) sfdr snr -120 -110 -100 -90 -80 -70 -60 40 70 100 130 160 190 220 250 sample rate (msps) hd2 and hd3 magnitude (dbc) hd2 hd3
kad5512p fn6807 rev 5.00 page 16 of 36 may 31, 2016 figure 12. power vs f sample in 3ma lvds mode figure 13. differential nonlinearity figure 14. integral nonlinearity fi gure 15. snr and sfdr vs vcm figure 16. noise histogram figure 17. single-tone spectrum at 10mhz typical performance curves all typical performance characteristics appl y under the following conditions unless otherwise noted: avdd = ovdd = 1.8v, t a = +25c, a in = -1dbfs, f in = 105mhz, f sample = maximum conversion rate (per speed grade). (continued) 0 50 100 150 200 250 300 40 70 100 130 160 190 220 250 sample rate (msps) total power (mw) ddr sdr 0 512 1024 1536 204 8 2560 3072 3584 4096 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 code dnl (lsbs) 0 512 1024 1536 2048 2560 3072 3584 4096 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 code inl (lsbs) 50 55 60 65 70 75 80 85 90 300 400 500 600 700 800 input common-mode (mv) snr (dbfs) and sfdr (dbc) snr sfdr 2050 2051 2052 2053 2054 2055 2056 2057 2058 0 30000 60000 90000 120000 150000 180000 210000 240000 270000 code number of hits 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 frequency (mhz) ain = -1.0dbfs snr = 66.0dbfs sfdr = 82.5dbc sinad = 65.9dbfs amplitude (dbfs)
kad5512p fn6807 rev 5.00 page 17 of 36 may 31, 2016 figure 18. single-tone spectrum at 105mhz figure 19. single-tone spectrum at 190mhz figure 20. single-tone spectrum at 495mhz figure 21. single-tone spectrum at 995mhz figure 22. two-tone spectrum at 70mhz fi gure 23. two-tone spectrum at 170mhz typical performance curves all typical performance characteristics appl y under the following conditions unless otherwise noted: avdd = ovdd = 1.8v, t a = +25c, a in = -1dbfs, f in = 105mhz, f sample = maximum conversion rate (per speed grade). (continued) 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 frequency (mhz) amplitude (dbfs) ain = -1.0dbfs snr = 66.0dbfs sfdr = 86.5dbc sinad = 65.9dbfs 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 ain = -1.0dbfs snr = 65.7dbfs sfdr = 79.2dbc sinad = 65.4dbfs frequency (mhz) amplitude (dbfs) 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 amplitude (dbfs) frequency (mhz) ain = -1.0dbfs snr = 64.4dbfs sfdr = 68.8dbc sinad = 62.6dbfs 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 frequency (mhz) amplitude (dbfs) ain = -1.0dbfs snr = 61.6dbfs sfdr = 49.8dbc sinad = 49.8dbfs 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 imd = -85.7dbfs frequency (mhz) amplitude (dbfs) 0 20 40 60 80 100 120 -120 -100 -80 -60 -40 -20 0 imd = -97.1dbfs amplitude (dbfs) frequency (mhz)
kad5512p fn6807 rev 5.00 page 18 of 36 may 31, 2016 theory of operation functional description the kad5512p is based upon a 12-bit, 250msps a/d converter core that utilizes a pipelined successive approximation architecture ( figure 24 ). the input voltage is captured by a sample-hold amplifier (sha) and converted to a unit of charge. proprietary charge-domain techniques are used to successively compare the input to a series of reference charges. decisions made during the successive appr oximation operations determine the digital code for each inpu t value. the converter pipeline requires six samples to produce a re sult. digital error correction is also applied, resulting in a total latency of seven and one half clock cycles. this is evident to the user as a time lag between the start of a conversion and the data being available on the digital outputs. power-on calibration the adc performs a self-calibrati on at start-up. an internal power-on reset (por) circuit detects the supply voltage ramps and initiates the calibration when the analog and digital supply voltages are above a th reshold. the following conditions must be adhered to for the power-on calibration to execute successfully: ? a frequency-stable conversion clock must be applied to the clkp/clkn pins ? dnc pins (especially 3, 4 and 18) must not be pulled up or down ? sdo (pin 66) must be high ? resetn (pin 25) must begin low ? spi communications must not be attempted a user-initiated reset can subsequently be invoked in the event that the previously mentioned conditions cannot be met at power-up. the sdo pin requires an external 4.7k pull-up to ovdd. if the sdo pin is pulled low externally during power-up, calibration will not be executed properly. after the power supply has stabilized, the internal por releases resetn and an internal pull-up pull s it high starting the calibration sequence. when the resetn pin is driven by external logic, it should be connected to an open -drain output with open-state leakage of less than 0.5ma to assure exit from the reset state. a driver that can be switched from logic low to high impedance can also be used to drive resetn provided the high impedance state leakage is less than 0.5ma and the logic voltages are the same. the calibration sequence is initiated on the rising edge of resetn, as shown in figure 25 on page 19 . the over-range (or) output is set high once resetn is pulled low, and remains in that state until calibration is complete. the or output returns to normal operation at that time, so it is important that the analog input be within the converter?s full-scale range to observe the transition. if the input is in an over-range condition, the or pin will stay high, and it will not be possible to detect the end of the calibration cycle. while resetn is low, the output clock (clkoutp/clkoutn) is set low. normal operation of the output clock resumes at the next input clock edge (clkp/clkn) after resetn is deasserted. at 250msps the nominal calibrati on time is 200ms, while the maximum calibration time is 550ms. figure 24. adc core block diagram digital error correction sha 1.25v inp inn clock generation 2.5-bit flash 6-stage 1.5-bit/stage 3-stage 1-bit/stage 3-bit flash lvds/lvcmos outputs + C
kad5512p fn6807 rev 5.00 page 19 of 36 may 31, 2016 user-initiated reset recalibration of the adc can be in itiated at any time by driving the resetn pin low for a minimum of one clock cycle. an open-drain driver with less than 0.5ma open-state leakage is recommended so the internal high impedance pull-up to ovdd can assure exit from the reset state. as is the case during power-on reset, the sdo, resetn and dnc pins must be in the proper state for the calibration to successfully execute. the performance of the kad5512p changes with variations in temperature, supply voltage or sample rate. the extent of these changes may necessitate recalibr ation, depending on system performance requirements. best performance will be achieved by recalibrating the adc under th e environmental conditions at which it will operate. a supply voltage variation of less than 100mv will generally result in an snr change of le ss than 0.5dbfs and sfdr change of less than 3dbc. in situations where the sample ra te is not constant, best results will be obtained if the device is calibrated at the highest sample rate. reducing the sample rate by less than 75msps will typically result in an snr change of less than 0.5dbfs and an sfdr change of less than 3dbc. figures 26 and 27 show the effect of temperature on snr and sfdr performance with calibrat ion performed at -40c, +25c, and +85c. each plot shows the variation of snr/sfdr across temperature after a single calibration at -40c, +25c and +85c. best performance is typically achieved by a user-initiated calibration at the operating co nditions, as stated earlier. however, it can be seen that performance drift with temperature is not a very strong function of the temperature at which the calibration is performed. full-rat ed performance will be achieved after power-up calibration regard less of the operating conditions. analog input the adc core contains a fully di fferential input (vinp/vinn) to the sample and hold amplifier (sha). the ideal full-scale input voltage is 1.45v, centered at the vcm voltage of 0.535v as shown in figure 28 . best performance is obtained when the analog inputs are driven differentially. the common-mode output voltage, vcm, should be used to properly bias the inputs as shown in figures 29 through 31 . an rf transformer will give the best noise and distortion performance for wideband and/or high intermediate frequency (if) inputs. two different transf ormer input schemes are shown in figures 29 and 30 . figure 25. calibration timing clkp clkn clkoutp resetn orp calibration begins calibration complete calibration time figure 26. snr performance vs temperature -4 -3 -2 -1 0 1 2 3 -40 -15 10 35 60 85 snr change (dbfs) cal done at +85c temperature (c) cal done at -40c cal done at +25c figure 27. sfdr performance vs temperature -15 -10 -5 0 5 10 15 -40 -15 10 35 60 85 sfdr change (dbc) temperature (c) cal done at -40c cal done at +25c cal done at +85c figure 28. analog input range 1.0 1.8 0.6 0.2 1.4 inp inn vcm 0.535v 0.725v
kad5512p fn6807 rev 5.00 page 20 of 36 may 31, 2016 this dual transformer scheme is used to improve common-mode rejection, which keeps the co mmon-mode level of the input matched to vcm. the value of the shunt resistor should be determined based on the desired load impedance. the differential input resistance of the kad5512p is 1000 . the sha design uses a switched capacitor input stage (see figure 44 on page 29 ), which creates current spikes when the sampling capacitance is reconnected to the input voltage. this causes a disturbance at the input, which must settle before the next sampling point. lower source impedance will result in faster settling and improved performance. therefore a 1:1 transformer and low shunt resistance are recommended for optimal performance. a differential amplifier, as shown in figure 31 , can be used in applications that require dc-coupl ing. in this configuration, the amplifier will typically dominate the achievable snr and distortion performance. the current spikes from the sha will try to force the analog input pins toward ground. in cases where the input pins are biased with more than 50 in series from vcm care must be taken to make sure the input common-mode range is not violated. the provided icm value (250a/mhz * 250mhz = 625a at 250msps) may be used to calculate the expected voltage drop across any series resistance. vcm output the vcm output is buffered with a series output impedance of 20 . it can easily drive a typical adc driver?s 10k common-mode control pin. if an external buffer is not used the voltage drop across the internal 20 impedance must be considered when calculating the expected dc bias voltage at the analog input pins. clock input the clock input circuit is a differential pair (see figure 45 on page 29 ). driving these inputs with a high level (up to 1.8v p-p on each input) sine or square wave will provide the lowest jitter performance. a transformer with 4:1 impedance ratio will provide increased drive levels. the recommended drive circuit is shown in figure 32 . a duty range of 40% to 60% is acceptable. the clock can be driven single-ended, but this will reduce the edge rate and may impact snr performance. the clock inputs are internally self-biased to avdd/2 to facilitate ac coupling. a selectable 2x frequency divider is provided in series with the clock input. the divider can be used in the 2x mode with a sample clock equal to twice the desired sample rate. this allows the use of the phase slip feature, which enables synchronization of multiple adcs. the clock divider can also be controlled through the spi port, which overrides the clkdiv pin setting. details on this are contained in ? serial peripheral interface ? on page 24 . a delay-locked loop (dll) genera tes internal clock signals for various stages within the charge pipeline. if the frequency of the input clock changes, the dll may take up to 52s to regain lock at 250msps. the lock time is inversely proportional to the sample rate. jitter in a sampled data system, cloc k jitter directly impacts the achievable snr performance. the theoretical relationship between clock jitter (t j ) and snr is shown in equation 1 and is illustrated in figure 33 . figure 29. transformer input for general purpose applications adt1-1wt 0.1f kad5512p vcm adt1-1wt 1000pf figure 30. transmission-line transformer input for high if applications adtl1-12 0.1f kad5512p vcm adtl1-12 1000pf 1000pf kad5512p vcm 0.1f 0.22f 69.8 49.9 100 100 348 348 cm 217 25 25 69.8 figure 31. differential amplifier input figure 32. recommended clock drive tc4-1w 200pf 200o 200pf 200pf clkp clkn 1000pf
kad5512p fn6807 rev 5.00 page 21 of 36 may 31, 2016 this relationship shows the snr that would be achieved if clock jitter were the only non-ideal factor. in reality, achievable snr is limited by internal factors such as linearity, aperture jitter and thermal noise. internal aperture jitter is the uncertainty in the sampling instant shown in figure 4 on page 13 . the internal aperture jitter combines with the input clock jitter in a root-sum- square fashion, since they are not statistically correlated, and this determines the total jitter in the system. the total jitter, combined with other noise sources, then determines the achievable snr. voltage reference a temperature compensated volt age reference provides the reference charges used in the successive approximation operations. the full-scale range of each a/d is proportional to the reference voltage. the voltage reference is internally bypassed and is not accessible to the user. digital outputs output data is available as a parallel bus in lvds-compatible or cmos modes. additionally, the data can be presented in either double data rate (ddr) or single data rate (sdr) formats. the even numbered data output pins are active in ddr mode in the 72 ld package option. when clkout is low the msb and all odd logical bits are output, while on the high phase the lsb and all even logical bits are presented (this is true in both the 72 ld and 48 ld package options). figures 4 and 5 show the timing relationships for lvds/cmos and ddr/sdr modes. the 48 ld qfn package option cont ains six lvds data output pin pairs, and therefore can only support ddr mode. additionally, the drive current for lvds mode can be set to a nominal 3ma or a power-saving 2ma. the lower current setting can be used in designs where the receiver is in close physical proximity to the adc. the applicability of this setting is dependent upon the pcb layout, therefore the user should experiment to determine if performance degradation is observed. the output mode and lvds drive current are selected via the outmode pin as shown in table 3 . the output mode can also be co ntrolled through the spi port, which overrides the outmode pin setting. details on this are contained in ? serial peripheral interface ? on page 24 . an external resistor creates the bias for the lvds drivers. a 10k , 1% resistor must be connected from the rlvds pin to ovss. over range indicator the over-range (or) bit is assert ed when the output code reaches positive full-scale (e.g. 0xfff in offset binary mode). the output code does not wrap around during an over-range condition. the or bit is updated at the sample rate. power dissipation the power dissipated by the kad5512p is primarily dependent on the sample rate and the output modes: lvds vs cmos and ddr vs sdr. there is a static bias in the analog supply, while the remaining power dissipation is linearly related to the sample rate. the output supply dissipation is approximately constant in lvds mode, but linearly related to the clock frequency in cmos mode. figures 37 and 38 illustrate these relationships. nap/sleep portions of the device may be shut down to save power during times when operation of the adc is not required. two power saving modes are available: nap and sleep. nap mode reduces power dissipation to less than 98.6mw and recovers to normal operation in approximately 1s. sleep mode reduces power dissipation to less than 6mw but requires approximately 1ms to recover from a sleep command. wake-up time from sleep mode is dependent on the state of csb; in a typical application csb would be held high during sleep, requiring a user to wait 150s maximum after csb is asserted (brought low) prior to writing ?001x? to spi register 25. the device would be fully powered up, in normal mode 1ms after this command is written. wake-up from sleep mode sequence (csb high) ?pull csb low ? wait 150s ? write ?001x? to register 25 ? wait 1ms until adc fully powered on in an application where csb was kept low in sleep mode, the 150s csb set-up time is not required as the spi registers are powered on when csb is low, the chip power dissipation increases by ~ 15mw in this case. the 1ms wake-up time after the write of a ?001x? to register 25 still applies. it is generally recommended to keep csb high in sleep mode to avoid any unintentional spi activity on the adc. snr 20 log 10 1 2 ? f in t j ------------------- - ?? ?? = (eq. 1) figure 33. snr vs clock jitter t j = 100ps t j = 10ps t j = 1ps t j = 0.1ps 10 bits 12 bits 14 bits 50 55 60 65 70 75 80 85 90 95 100 1 10 100 1000 snr (db) input frequency (mhz)
kad5512p fn6807 rev 5.00 page 22 of 36 may 31, 2016 all digital outputs (data, clkout and or) are placed in a high impedance state during nap or sleep. the input clock should remain running and at a fixed frequency during nap or sleep, and csb should be high. recovery time from nap mode will increase if the clock is stopped, since the internal dll can take up to 52s to regain lock at 250msps. by default after the device is powered on, the operational state is controlled by the napslp pin as shown in table 4 . the power-down mode can also be controlled through the spi port, which overrides the napslp pin setting. details on this are contained in ? serial peripheral interface ? on page 24 . this is an indexed function when controlled from the spi, but a global function when driven from the pin. data format output data can be presented in three formats: two?s complement, gray code and offset binary. the data format is selected via the outfmt pin as shown in table 5 . the data format can also be co ntrolled through the spi port, which overrides the outfmt pin setting. details on this are contained in ? serial peripheral interface ? on page 24 . offset binary coding maps the most negative input voltage to code 0x000 (all zeros) and the mo st positive input to 0xfff (all ones). two?s complement coding simply complements the msb of the offset binary representation. when calculating gray code the msb is unchanged. the remaining bits are computed as the xor of the current bit position and the next most significant bit. figure 34 shows this operation. converting back to offset binary from gray code must be done recursively, using the result of each bit for the next lower bit as shown in figure 35 . mapping of the input voltage to the various data formats is shown in table 6 . table 4. napslp pin settings napslp pin mode avss normal float sleep avdd nap table 5. outfmt pin settings outfmt pin mode avss offset binary float two?s complement avdd gray code figure 34. binary to gray code conversion 10 11 9 0 1 binary 10 11 9 0 gray code ? ? ? ? ? ? ? ? ? ? ? ? 1 figure 35. gray code to binary conversion 10 11 9 0 1 binary 10 11 9 0 gray code ? ? ? ? ? ? ? ? ? ? ? ? 1 ? ? ? ?
kad5512p fn6807 rev 5.00 page 23 of 36 may 31, 2016 figure 36. msb-first addressing csb sclk sdio r/w w1 w0 a12 a11 a1 a0 d7 d6 d5 d4 d3 d2 d1d 0 a10 figure 37. lsb-first addressing csb sclk sdio r/w w1 w0 a12 a11 a1 a0 d7 d6 d5 d4 d3 d2 d1 d0 a2 figure 38. spi write t s t hi t clk t lo r/w w1w0a12a11a10a9a8a7 d5 d4 d3 d2 d1 d0 t h t dhw t dsw spi write csb sclk sdio figure 39. spi read (3-wire mode) (4-wire mode) r/w w1 w0 a12 a11 a10 a9 a2 a1 d7 d6 d3 d2 d1 d7 d3 d2 d1 d0 a0 writing a read co mmand reading data d0 t h t dhr t dvr spi read t hi t clk t dhw t s csb sclk sdio sdo t lo t dsw figure 40. 2-byte transfer csb sclk sdio instruction/address data word 1 data word 2 csb stalling
kad5512p fn6807 rev 5.00 page 24 of 36 may 31, 2016 serial peripheral interface a serial peripheral interface (s pi) bus is used to facilitate configuration of the device and to optimize performance. the spi bus consists of chip select bar (c sb), serial clock (sclk) serial data output (sdo), and serial data input/output (sdio). the maximum sclk rate is equal to the adc sample rate (f sample ) divided by 16 for write operations and f sample divided by 66 for reads. at f sample = 250mhz, maximum sclk is 15.63mhz for writing and 3.79mhz for read op erations. there is no minimum sclk rate. the following sections describe various registers that are used to configure the spi or adjust perfor mance or functional parameters. many registers in the available address space (0x00 to 0xff) are not defined in this document. additionally, within a defined register there may be certain bits or bit combinations that are reserved. undefined registers and undefined values within defined registers are reserved and should not be selected. setting any reserved register or value may produce indeterminate results. spi physical interface the serial clock (sclk) pin provides synchronization for the data transfer. by default, all data is presented on the serial data input/output (sdio) pin in 3-wire mode. the state of the sdio pin is set automatically in the communication protocol (described below). a dedicated serial data output (sdo) pin can be activated by setting 0x00[7] high to allow operation in 4-wire mode. sdo should always be connected to ovdd with a 4.7k resistor even if not used. if the 4.7k resistor is not present the adc will not exit the reset state. the spi port operates in a half duplex master/slave configuration, with the kad5512p functioning as a slave. multiple slave devices can interfac e to a single master in 3-wire mode only, since the sdo output of an unaddressed device is asserted in 4-wire mode. the chip select bar (csb) pin determines when a slave device is being addressed. multiple slav e devices can be written to concurrently, but only one slave device can be read from at a given time (again, only in 3-wire mode). if multiple slave devices are selected for reading at the same time, the results will be indeterminate. the communication protocol begins with an instruction/address phase. the first rising sclk edge following a high to low transition on csb determines the beginning of the two-byte instruction/address command; sclk must be static low before the csb transition. data can be presented in msb-first order or lsb-first order. the default is msb-first, but this can be changed by setting 0x00[6] high. figures 36 and 37 show the appropriate bit ordering for the msb-first and lsb-first modes, respectively. in msb-first mode the address is incremented for multi-byte transfers, while in lsb-fi rst mode it?s decremented. in the default mode, the msb is r/w, which determines if the data is to be read (active high) or written. the next two bits, w1 and w0, determine the number of data bytes to be read or written (see table 7 ). the lower 13 bits contain the first address for the data transfer. this relationship is illustrated in figure 38 , and timing values are given in ? switching specifications ? on page 14 . after the instruction/address bytes have been read, the appropriate number of data bytes are written to or read from the adc (based on the r/w bit status). the data transfer will continue as long as csb remains low and sclk is active. stalling of the csb pin is allowed at any byte boundary (instruction/address or data) if the number of bytes being transferred is three or less. for transfers of four bytes or more, csb is allowed stall in the mi ddle of the instruction/address bytes or before the first data byte. if csb transitions to a high state after that point the state machine will reset and terminate the data transfer. figures 40 and 41 illustrate the timing relationships for 2-byte and n-byte transfers, respectively. the operation for a 3-byte transfer can be inferred from these diagrams. spi configuration address 0x00: chip_port_config bit ordering and spi reset are cont rolled by this register. bit order can be selected as msb to lsb (msb first) or lsb to msb (lsb first) to accommodate various microcontrollers. bit 7 sdo active bit 6 lsb first setting this bit high configures the spi to interpret serial data as arriving in lsb to msb order. figure 41. n-byte transfer csb sclk sdio instruction/address data word 1 data word n last legal csb stalling
kad5512p fn6807 rev 5.00 page 25 of 36 may 31, 2016 bit 5 soft reset setting this bit high resets all spi registers to default values. bit 4 reserved this bit should always be set high. bits 3:0 these bits should always mirror bits 4:7 to avoid ambiguity in bit ordering. address 0x02: burst_end if a series of sequential register s are to be set, burst mode can improve throughput by eliminating redundant addressing. in 3-wire spi mode the burst is ended by pulling the csb pin high. if the device is operated in 2-wire mode the csb pin is not available. in that case, setting the burst_end address determines the end of the transfer. during a write operation, the user must be cautious to transmit the corre ct number of bytes based on the starting and ending addresses. bits 7:0 burst end address this register value determines the ending address of the burst data. device information address 0x08: chip_id address 0x09: chip_version the generic die identifier and a revision number, respectively, can be read from these two registers. indexed device configuration/control address 0x10: device_index_a a common spi map, which can ac commodate single-channel or multi-channel devices, is used for all intersil adc products. certain configuration commands (i dentified as indexed in the spi map) can be executed on a per-converter basis. this register determines which converter is being addressed for an indexed command. it is important to note that only a single converter can be addressed at a time. this register defaults to 00h, indicating that no adc is addressed. therefore bit 0 must be set high in order to execute any indexed commands. error code ?ad? is returned if any indexed register is read fr om without properly setting device_index_a. address 0x20: offset_coarse and address 0x21: offset_fine the input offset of the adc core can be adjusted in fine and coarse steps. both adjustments are made via an 8-bit word as detailed in table 8 . the default value of each register will be the result of the self-calibration after initial power-up. if a register is to be incremented or decremented, the user should first read the register value then write the incremented or decremented value back to the same register. address 0x22: gain_coarse address 0x23: gain_medium address 0x24: gain_fine gain of the adc core can be adjusted in coarse, medium and fine steps. coarse gain is a 4-bit ad justment while medium and fine are 8-bit. multiple coarse gain bits can be set for a total adjustment range of 4.2% (?0011? =~ -4.2% and ?1100? =~ +4.2%). it is recommended to use one of the coarse gain settings (-4.2%, -2.8%, -1 .4%, 0, 1.4%, 2.8%, 4.2%) and fine-tune the gain using the registers at 23h and 24h. the default value of each register will be the result of the self-calibration after initial power-up. if a register is to be incremented or decremented, the user should first read the register value then write the incremented or decremented value back to the same register. address 0x25: modes two distinct reduced power modes can be selected. by default, the tri-level napslp pin can select normal operation or sleep modes (refer to ? nap/sleep ? on page 21 ). this functionality can be overridden and controlled throug h the spi. this is an indexed table 8. offset adjustments parameter 0x20[7:0] coarse offset 0x21[7:0] fine offset steps 255 255 ?full-scale (0x00) -133 lsb (-47mv) -5 lsb (-1.75mv) mid-scale (0x80) 0.0 lsb (0.0mv) 0.0lsb +full-scale (0xff) +133 lsb (+47mv) +5 lsb (+1.75mv) nominal step size 1.04 lsb (0.37mv) 0.04 lsb (0.014mv) table 9. coarse gain adjustment 0x22[3:0] nominal coarse gain adjust (%) bit 3 +2.8 bit 2 +1.4 bit 1 -2.8 bit 0 -1.4 table 10. medium and fine gain adjustments parameter 0x23[7:0] medium gain 0x24[7:0] fine gain steps 256 256 ?full-scale (0x00) -2% -0.20% mid-scale (0x80) 0.00% 0.00% +full-scale (0xff) +2% +0.2% nominal step size 0.016% 0.0016%
kad5512p fn6807 rev 5.00 page 26 of 36 may 31, 2016 function when controlled from the spi, but a global function when driven from the pin. this register is not changed by a soft reset. nap mode must be entered by executing the following sequence: return to normal operation as follows: global device configuration/control address 0x71: phase_slip when using the clock divider, it?s not possible to determine the synchronization of the incoming and divided clock phases. this is particularly important when multiple adcs are used in a time-interleaved system. the phase slip feature allows the rising edge of the divided clock to be advanced by one input clock cycle when in clk/4 mode, as shown in figure 42 . execution of a phase_slip command is accomplished by first writing a ?0? to bit 0 at address 71h followed by writing a ?1? to bit 0 at address 71h (32 sclk cycles). address 0x72: clock_divide the kad5512p has a selectable cl ock divider that can be set to divide by four, two or one (no divi sion). by default, the tri-level clkdiv pin selects the divisor (refer to ? vcm output ? on page 20 ). this functionality can be overridden and controlled through the spi, as shown in table 12 . this register is not changed by a soft reset. address 0x73: output_mode_a the output_mode_a register controls the physical output format of the data, as well as the lo gical coding. the kad5512p can present output data in two physical formats: lvds or lvcmos. additionally, the drive strength in lvds mode can be set high (3ma) or low (2ma). by default, the tri-level outmode pin selects the mode and drive level (refer to ? digital outputs ? on page 21 ). this functionality can be overridden and controlled through the spi, as shown in table 13 . data can be coded in three possi ble formats: two?s complement, gray code or offset binary. by default, the tri-level outfmt pin selects the data format (refer to ? data format ? on page 22 ). this functionality can be overridden and controlled through the spi, as shown in table 14 . this register is not changed by a soft reset. table 11. power-down control value 0x25[2:0] power-down mode 000 pin control 001 normal operation 010 nap mode 100 sleep mode sequence register value 1 0x10 0x01 2 0x25 0x02 3 0x10 0x02 4 0x25 0x02 sequence register value 1 0x10 0x01 2 0x25 0x01 3 0x10 0x02 4 0x25 0x01 figure 42. phase slip: clk4 mode, f clock = 1000mhz clk clk4 clk4 slip once clk = clkp C clkn clk4 slip twice 1.00ns 4.00ns
kad5512p fn6807 rev 5.00 page 27 of 36 may 31, 2016 address 0x74: output_mode_b address 0x75: config_status bit 6 dll range this bit sets the dll operating range to fast (default) or slow. internal clock signals are generated by a delay-locked loop (dll), which has a finite operating range. table 15 shows the allowable sample rate ranges for the slow and fast settings. the output_mode_b and config_s tatus registers are used in conjunction to enable ddr mode and select the frequency range of the dll clock generator. the method of setting these options is different from the other registers. the procedure for setting output_mode_b is shown in figure 43 . read the contents of output_mode_b and config_status and xor them. then xor this result with the desired value for output_mode_b and write that xor result to the register. device test the kad5512 can produce preset or user defined patterns on the digital outputs to facilitate in si tu testing. a static word can be placed on the output bus, or two different words can alternate. in the alternate mode, the values defined as word 1 and word 2 (as shown in table 16 ) are set on the output bus on alternating clock phases. the test mode is enabled asynchronously to the sample clock, therefore several sample clock cycles may elapse before the data is present on the output bus. address 0xc0: test_io bits 7:6 user test mode these bits set the test mode to static (0x00) or alternate (0x01) mode. other values are reserved. the four lsbs in this register (output test mode) determine the test pattern in combination with registers 0xc2 through 0xc5. refer to table 18 . address 0xc2: user_patt1_lsb and address 0xc3: user_patt1_msb these registers define the lower and upper eight bits, respectively, of the first user-defined test word. address 0xc4: user_patt2_lsb and address 0xc5: user_patt2_msb these registers define the lower and upper eight bits, respectively, of the second user-defined test word. 72 ld/48 ld package options the kad5512 is available in both 72 ld and 48 ld packages. the 48 ld package option supports lvds ddr only. a reduced set of pin selectable functions are available in the 48 ld package due to the reduced pinout; (outmode, outfmt, and clkdiv pins are not available). table 17 shows the default state for these functions for the 48 ld package. note that these functions are available through the spi, allowing a user to set these modes as they desire, offering the same flexibility as the 72 ld package option. dc and ac performance of the adc is equivalent for both package options. table 15. dll ranges dll range min max unit slow 40 100 msps fast 80 f s max msps table 16. output test modes value 0xc0[3:0] output test mode word 1 word 2 0000 off 0001 midscale 0x8000 n/a figure 43. setting output_mode_b register read config_status 0x75 read output_mode_b 0x74 desired value write to 0x74
kad5512p fn6807 rev 5.00 page 28 of 36 may 31, 2016 spi memory map table 18. spi memory map addr (hex) parameter name bit 7 (msb) bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (lsb) def. value (hex) indexed/ global spi config 00 port_config sdo active lsb first soft reset mirror (bit 5) mirror (bit 6) mirror (bit 7) 00h g 01 reserved reserved 02 burst_end burst end address [7:0] 00h g 03-07 reserved reserved info 08 chip_id chip id # read only g 09 chip_version chip version # read only g indexed device config/control 10 device_index_a reserved adc00 00h i 11-1f reserved reserved 20 offset_coarse coarse offset cal. value i 21 offset_fine fine offset cal. value i 22 gain_coarse reserved coarse gain cal. value i 23 gain_medium medium gain cal. value i 24 gain_fine fine gain cal. value i 25 modes reserved power-down mode [2:0] 000 = pin control 001 = normal operation 010 = nap 100 = sleep other codes = reserved 00h not affected by soft reset i 26-5f reserved reserved 60-6f reserved reserved global device config/control 70 reserved reserved 71 phase_slip reserved next clock edge 00h g 72 clock_divide cl ock divide [2:0] 000 = pin control 001 = divide by 1 010 = divide by 2 100 = divide by 4 other codes = reserved 00h not affected by soft reset g 73 output_mode_a output mode [2:0] 000 = pin control 001 = lvds 2ma 010 = lvds 3ma 100 = lvcmos other codes = reserved output format [2:0] 000 = pin control 001 = two?s complement 010 = gray code 100 = offset binary other codes = reserved 00h not affected by soft reset g 74 output_mode_b dll range 0 = fast 1 = slow ddr enable ( note 15 ) 00h not affected by soft reset g 75 config_status xor result xor result read only g 76-bf reserved reserved
kad5512p fn6807 rev 5.00 page 29 of 36 may 31, 2016 device test c0 test_io user test mode [1:0] 00 = single 01 = alternate 10 = reserved 11 = reserved output test mode [3:0] 00h g 0 = off 1 = midscale short 2 = +fs short 3 = -fs short 4 = checker board 5 = reserved 6 = reserved 7 = one/zero word toggle 8 = user input 9-15 = reserved c1 reserved reserved 00h g c2 user_patt1_lsb b7 b6 b5 b4 b3 b2 b1 b0 00h g c3 user_patt1_msb b15 b14 b13 b12 b11 b10 b9 b8 00h g c4 user_patt2_lsb b7 b6 b5 b4 b3 b2 b1 b0 00h g c5 user_patt2_msb b15 b14 b13 b12 b11 b10 b9 b8 00h g c6-ff reserved reserved note: 15. at power-up, the ddr enable bit is at a logic ?0? for the 72 ld package and set to a logic ?1? internally for the 48 ld pack age by an internal pull-up. table 18. spi memory map (continued) addr (hex) parameter name bit 7 (msb) bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (lsb) def. value (hex) indexed/ global equivalent circuits figure 44. analog inputs figure 45. clock inputs avdd inp inn avdd f1 f1 f2 f3 f2 f3 csamp 1.6pf csamp 1.6pf to charge pipeline to charge pipeline 1000o ? ? ? ? ? ? avdd clkp clkn avdd avdd to clock- phase generation 11ko 11ko avdd 18ko 18ko
kad5512p fn6807 rev 5.00 page 30 of 36 may 31, 2016 figure 46. tri-level digital inputs figure 47. digital inputs figure 48. lvds outputs figure 49. cmos outputs figure 50. vcm_out output equivalent circuits (continued) avdd input avdd avdd avdd to sense logic 75ko 75ko 75ko 75ko 280o input ovdd ovdd 280 ? to logic ovdd (20k pull-up on resetn only) 20k ? d[11:0]p ovdd ovdd 2ma or 3ma 2ma or 3ma data data data data d[11:0]n ovdd d[11:0] ovdd ovdd data vcm avdd 0.535v + C
kad5512p fn6807 rev 5.00 page 31 of 36 may 31, 2016 adc evaluation platform intersil offers an adc evaluation platform which can be used to evaluate any of the kadxxxxx adc family. the platform consists of a fpga based data capture mo therboard and a family of adc daughtercards. this usb based platform allows a user to quickly evaluate the adc?s performance at a user?s specific application frequency requirements. more information is available at: http://www.intersil.com/converters/adc_eval_platform/ layout considerations pcb layout example for an example application circuit and pcb layout, please refer to the evaluation board documentation: kad5512p -25 kad5512p -21 kad5512p -17 kad5512p -12 there are separate evaluation bo ards for the 48 ld and 72 ld packages. split ground and power planes data converters operating at high sampling frequencies require extra care in pc board layout. many complex board designs benefit from isolating the analog and digital sections. analog supply and ground planes should be laid out under signal and clock inputs. locate the digital planes under outputs and logic pins. grounds should be joined under the chip. clock input considerations use matched transmission lines to the transformer inputs for the analog input and clock signals. locate transformers and terminations as close to the chip as possible. exposed paddle the exposed paddle must be electrically connected to analog ground (avss) and should be connected to a large copper plane using numerous vias for optimal thermal performance. bypass and filtering bulk capacitors should have lo w equivalent series resistance. tantalum is a good choice. for best performance, keep ceramic bypass capacitors very close to device pins. longer traces will increase inductance, resulting in diminished dynamic performance and accuracy. make sure that connections to ground are direct and low impedance. avoid forming ground loops. lvds outputs output traces and connections must be designed for 50 (100 differential) characteristic im pedance. keep traces direct and minimize bends where possibl e. avoid crossing ground and power-plane breaks with signal traces. lvcmos outputs output traces and connections must be designed for 50 characteristic impedance. unused inputs standard logic inputs (resetn, csb, sclk and sdio), which will not be operated do not require connection to ensure optimal adc performance. these inputs can be left floating if they are not used. the sdo output must be connected to ovdd with a 4.7k resistor or the adc will not exit the reset state. tri-level inputs (napslp, outmode, outfmt an d clkdiv) accept a floating input as a valid state, and therefore should be biased according to the desired functionality. general powerpad design considerations the following figure is a generic illustration of how to use vias to remove heat from a qfn package with an exposed thermal pad. a specific example can be found in the evaluation board pcb layout previously referenced. filling the exposed thermal pad area with vias provides optimum heat transfer to the pcb?s internal plane(s). vias should be evenly distributed from edge-to-edge on the exposed pad to maintain a constant temperature across the entire pad. setting the center-to-center spacing of the vias at three times the via pad radius will provide good heat transfer for high power devices. the vias below the kad5512p may be spaced further apart as shown on the evaluation board since it is a low-power device. the via diameter should be small but not too small to allow solder wicking during reflow. pcb fabr ication and assembly companies can provide specific guidelines based on the layer stack and assembly process. connect all vias under the kad5512p to avss. it is important to maximize the heat transfer by avoiding the use of ?thermal relief? patterns when connecting the vias to the internal avss plane(s). figure 51. pcb via pattern
kad5512p fn6807 rev 5.00 page 32 of 36 may 31, 2016 definitions analog input bandwidth is the analog input frequency at which the spectral output power at the fundamental frequency (as determined by fft analysis) is reduced by 3db from its full-scale low-frequency value. this is also referred to as full power bandwidth. aperture delay or sampling delay is the time required after the rise of the clock input for the sampling switch to open, at which time the signal is held for conversion. aperture jitter is the rms variation in aperture delay for a set of samples. clock duty cycle is the ratio of the time the clock wave is at logic high to the total time of one clock period. differential non-linearity (dnl) is the deviation of any code width from an ideal 1 lsb step. effective number of bits (enob) is an alternate method of specifying signal to noise-and-distortion ratio (sinad). in db, it is calculated as: enob = (sinad - 1.76)/6.02. gain error is the ratio of the difference between the voltages that cause the lowest and highest code transitions to the full-scale voltage less 2 lsb. it is typically expressed in percent. integral non-linearity (inl) is the maximum deviation of the adc?s transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of lsbs. least significant bit (lsb) is the bit that has the smallest value or weight in a digital word. its value in terms of input voltage is v fs /(2 n -1) where n is the resolution in bits. missing codes are output codes that ar e skipped and will never appear at the adc output. these codes cannot be reached with any input value. most significant bit (msb) is the bit that has the largest value or weight. pipeline delay is the number of clock cycles between the initiation of a conversion and th e appearance at the output pins of the data. power supply rejection ratio (psrr) is the ratio of the observed magnitude of a spur in the adc fft, caused by an ac signal superimposed on the power supply voltage. signal to noise-and-distortion (sinad) is the ratio of the rms signal amplitude to the rms sum of all other spectral components below one half the clock frequency, including harmonics but excluding dc. signal-to-noise ratio (without harmonics) is the ratio of the rms signal amplitude to the rms sum of all other spectral components below one-half the sampling frequency, excluding harmonics and dc. snr and sinad are either given in units of db when the power of the fundamental is used as the reference, or dbfs (db to full-scale) when the converter?s full-scale input power is used as the reference. spurious-free-dynamic range (sfdr) is the ratio of the rms signal amplitude to the rms value of the largest spurious spectral component. the largest spurious spectral component may or may not be a harmonic.
kad5512p fn6807 rev 5.00 page 33 of 36 may 31, 2016 revision history date revision change may 31, 2016 fn6807.5 updated entire datasheet applying intersil?s new standards. updated the maximum ?electrical specifications? for the following: -i avdd (kad5512p-25):96 to 101 (kad5512p-21):89 to 94 (kad5512p-17):82 to 87 (kad5512p-12):74 to 79 -nap mode (kad5512p-25):95 to 98.6 (kad5512p-21):91 to 94.6 (kad5512p-17):88 to 91.6 (kad5512p-12):84 to 87.6 updated 95 to 98.6 in ?nap/sleep? on page 21. replaced products section wi th about intersil section. october 10, 2010 fn6807.4 throughout: converted to new intersil data sheet template. added ?? on page 1. added note 3 to ?ordering information? on page 3 (?for moisture sensitivity level (msl), please see device information page for kad5512p-25, kad5512p-21, kad5512p-17, kad5512p-12. for more information on msl please see techbrief tb363.?) added tjc for both 72 & 48 ld qfns to ?thermal information? on page 9. added note 5 to page 9 (?for ? jc , the ?case temp? location is the center of the exposed metal pad on the package underside.?) added standard over temperature verbiage to common conditions of ?electrical specifications? table on page 9 ("boldface limits apply..") bolded applicable min max columns. added ?products? on page 34. changed the full power bandwidth (analog input bandwidth) from 1.3ghz to 1.5ghz in ?features?on page 1 and in ?full power bandwidth? on page 11. added the csb and sclk pins to the pin list for the iih, iil, vih and vil specs in the ?inputs? section of the ?digital specifications? table on page 12. clarified the sections describing the resetn external driv er requirements in ?power-on calibration? on page 18 and ?user-initiated reset? on page 19. added pad connection information to ?pin description? tables and pin configurations. added ?recommended operating conditions? on page 9. added typical ?icm? on page 9 for kad5512p-21 along with descriptive text in the ?analog input? section on page 20. added ?vcm output? on page 20. added a note to ?spi physical interface? on page 24 and ?unused inputs? on page 31 indicating the 4.7k resistor required from sdo to ovdd. added a link to the evaluation boards in the web product folder in ?pcb layout example? on page 31. added ?general powerpad design considerations? on page 31. added ?single-tone spectrum at 105m hz (250msps)? on page 1 (same as figure 18 from ?typical performance curves?) moved ?pin-compatible family? from page 1 to page 3. al so, added ?coming soon? to pre-release devices and added ?package? columns. october 01, 2009 fn6807.3 1) added nap mode, sleep mode wake up times to spec table 2) added csb, sclk setup time specs for nap, sleep modes 3) added section showing 72pin/48pin package feature differences and default state for clkdiv, outmode, outfmt page 27 4) changed spi setup time specs wording in spec table 5) added ?reserved? to spi memory map at address 25h 6) renumbered notes 7) added test platform link on page 31 8) added ddr enable note15 for 48 pin/72 pin options 9) changed pin description table for 72/48 pin option, added ddr notes 10) changed multi device note in spi physical in terface section to show 3-wire application.page 24 11) updated digital output section for ddr operation page 21 12) change to fig 26 and fig 27 and description in text 13) added connect note for thermal pad 14) formatted figures 25 and 26 with intersil standards 15) updated sinad 10mhz sinad typical (170msps) 16) updated sleep mode power spec 17) change to spi interface section in spec table, timing in cycles now, added write, read specific timing specs. 18) updated spi timing diagrams, figures 37, 38 19) updated wakeup time description in ?nap/sleep? on page 21. 20) removed calibration note in spec table 21) updated fig 46 label) 22) updated cal paragraph in user initiated reset section per dc.
fn6807 rev 5.00 page 34 of 36 may 31, 2016 kad5512p intersil products are manufactured, assembled and tested utilizing iso9001 quality systems as noted in the quality certifications found at www.intersil.com/en/suppor t/qualandreliability.html intersil products are sold by description on ly. intersil may modify the circuit design an d/or specifications of products at any time without notice, provided that such modification does not, in intersil's sole judgment, affect the form, fit or function of the product. accordingly, the reader is cautioned to verify that datasheets are current before placing orders. information fu rnished by intersil is believed to be accu rate and reliable. however, no responsib ility is assumed by intersil or its subsidiaries for its use; nor for any infrin gements of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com for additional products, see www.intersil.com/en/products.html ? copyright intersil americas llc 2008-2016. all rights reserved. all trademarks and registered trademarks are the property of their respective owners. about intersil intersil corporation is a leading provider of innovative power ma nagement and precision analog so lutions. the company's product s address some of the largest markets within the industrial and infrastr ucture, mobile computing and high-end consumer markets. for the most updated datasheet, application notes, related documentatio n and related parts, please see the respective product information page found at www.intersil.com . you may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask . reliability reports are also av ailable from our website at www.intersil.com/support . march 04, 2009 fn6807.2 changed ?odd? bits n in figure 1a - ddr to ?e ven? bits n, replaced pod l48. 7x7e due to changed dimension from ?9.80 sq? to ?6.80? sq. in land pattern january 16, 2009 fn6807.1 p1; revised key specs p2; added part marking column to order info p4; moved thermal resistance to thermal info table and added theta ja note 3 per packaging p4-6; revisions throughout spec tables. removed note from elec specs (nap mode must be invoked using spi.) added notes 9 and 10 to switching specs. p9; revised function for pin 22 outmode, pin 23 napslp and pin 70 outfmt p11; revised function for pin 16 napslp p13-15; performance curves revised throughout p17; user initiated reset - revised 2nd sentence of 1st paragraph p19; nap/sleep - revised 1st and 2nd sentences of 2nd paragraph p23; address 0x24: gain_fine; added 2 sentences to end of 1st paragraph. revised table 8 p22; serial peripheral interface- 1st paragraph; revised 2nd and 4th sentences. p24; removed figure (phase sl ip: clk2 mode, fclock = 500mhz) address 0x71: phase_slip; added sentence to end of paragraph p27; revised fig 45 p27; table 16; revised bits7:4, addr c0 throughout; formatted graphics to intersil standards december 5, 2008 fn6807.0 converted to intersil template. assigned file number fn6807. rev 0 - first release (as preliminary data sheet) with new file number. july 30, 2008 rev 1 initial release of production data sheet revision history (continued) date revision change
kad5512p fn6807 rev 5.00 page 35 of 36 may 31, 2016 package outline drawing l48.7x7e 48 lead quad flat no-lead plastic package rev 1, 2/09 located within the zone indica ted. the pin #1 i dentifier may be unless otherwise specified, tolerance: decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifie r is optional, but mus t be between 0.15mm and 0.30mm from the terminal tip. dimension b applies to the meta llized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to amsey14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: detail "x" side view typical recommended land pattern c 0. 2 ref 0. 05 max. 0. 00 min. 5 b 6 pin 1 index area 1 24 13 0.10 a mc b 4 a 4x 5.50 48x 0.40 48x 0.25 44x 0.50 7.00 7.00 0.90 max 48x 0.25 48x 0.60 44x 0.50 5.60 sq 6.80 sq 6 pin 1 index area exp. dap 5.60 sq. see detail "x" seating plane 0.08 0.10 c c c (4x) 0.15 12 25 48 37 36 top view bottom view connect exp. dap (pad) to avss with multiple vias to a low thermal impedance plane 7.
kad5512p fn6807 rev 5.00 page 36 of 36 may 31, 2016 package outline drawing l72.10x10d 72 lead quad flat no-lead plastic package rev 1, 11/08 located within the zone indicated . the pin #1 identifier may be unless otherwise specified, tolerance: decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifier is optional, but mus t be between 0.15mm and 0.30mm from the terminal tip. dimension b applies to the metalli zed terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to amsey14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: detail "x" side view typical recommended land pattern top view bottom view c 0. 2 ref 0. 05 max. 0. 00 min. 5 b 6 pin 1 index area 18 1 36 19 0.10 a mc b 4 a 4x 8.50 72x 0.40 72x 0.24 68x 0.50 10.00 10.00 0.90 max 72x 0.24 72x 0.60 68x 0.50 6.00 sq 9.80 sq 6 pin 1 index area exp. dap 6.00 sq. see detail "x" seating plane 0.08 0.10 c c c (4x) 0.15 37 54 72 55 connect exp. dap (pad) to avss with multiple vias to a low thermal impedance plane 7.

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